Dome + Dome Spring Probe for IC chipset, OD 0.26~3.50 mm

Crown + Round Spring Probe for IC chipset, OD 0.26~3.50 mm

Crown + Dome Spring Probe for IC chipset, OD 0.26~3.50 mm

Round + Round Spring Probe for IC chipset, OD 0.26~3.50 mm

Spring Probe for IC Chipset, 0.26~3.50, Best Design

Spring probe is a core component in IC chip tests, uses springs to achieve reliable electrical connections, tests PCBAs, ICs, semiconductors on performance, function, quality. Beryllium copper with plated gold or silver, Johoty provides perfect custom.

Features:

Stable low impedance, accurate testing signals.
Wear-resistant, long-lasting, high-frequency, strength.
Excellent frequency response and signal integrity.
Mechanical reliability and stable contact pressure.
Modular design, fits various testing requirements.
Eco-friendly, reliable certification for industry standards.

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Spring Probe for IC Chipset, OD 0.26~3.50mm, Description

Product Info: Spring probe is a high-end tool to test IC chips. Verify functional, test performance of IC chips. Its design and performance directly affect IC chip test accuracy and reliability.

Features: Not damage UUT chips, stable contact, high wear resistance, reliably match diameter, length, plunger shape to the test interface. Low contact resistance, high current carrying, high frequency. BeCu, tungsten steel, stainless steel, gold-plated or silver. Pointed, round, flat, grooved, coronal, fork shaped for BGA QFP、SOP， High fatigue life, pollution resistance, miniaturization, multi-pin parallel testing, dynamic impedance adjustment.

Solving Problems: Issues for reliable electrical contact, high-density packaging pin test, signal transfer & high-speed test, wear & lifespan, thermal & temperature stress, compatibility issues with multiple packaging, low or high current tests, production efficiency and cost control, testing environment adaptability, complex circuit board or chip soldering.

Specifications: Plunger tip diameter 0.1~2.0mm, sharp tip, flat, coronal, grooved, stroke 0.5~5mm, spring force 15~300gf, barrel diameter 0.2~2.5mm, contact resistance 15mΩ-30mΩ, current 0.5A – 5A, temp -40°C~+150°C. fit DIP、BGA、QFP、CSP、WLCSP, etc.

Applications: Test IC function, parameter, failure analysis, wafer/package/mass production screening, high density packaging, SiP test, 3D packaging, Intelligent Terminal , sensor test, functional safety, power device, high frequency communication chip, industrial automation, aerospace and military electronics, medical equipment,

Industries: Semiconductor manufacturing, consumer electronics, communication equipment, automotive electronics, industrial electronics, aerospace and military industry, medical electronics, education and research institutions, new energy industry.

Benefits: Accurate test data, avoid erroneous judgments, improve product yield, reduce rework rate of defective products. Meet IC chip high integration requirements, shorten test time, improve operational efficiency of production lines. Reduce labor & time costs of replacing consumables. Reduce costs and lower testing costs for each product unit. Enhance product quality and reliability, innovate and compete, reduce procurement complexity, lower material waste and operating costs, improve customer experience.

Spring Probe for IC Chipset, OD 0.26~3.50mm, Datasheet

Parameter	Typical Value Range
Length	10–50 mm
Stroke	2–10 mm
Spring Force	20–150 gf (gram-force)
Pin Diameter	0.26–3.50 mm
Durability	100,000–1,000,000 cycles
Current Rating	1–5 A
Contact Resistance	< 50 mΩ
Voltage Rating	100–500 V
Plunger Material	BeCu, steel, tungsten, or gold-plated
Spring Material	Stainless steel, music steel
Barrel Material	Brass, BeCu, phosphor bronze, gold-plated
Surface Coating	Gold, silver, nickel, or rhodium
Operating Temperature	-40°C to +150°C
Tip Style	Sharp, flat, crown, or concave
Tip Material Hardness	500–2,000 HV (Vickers Hardness)
Mounting Style	Press-fit, threaded, soldered
Compliance	Specified standards
Signal Integrity	≤ 3 GHz (low-speed), up to 40 GHz (high-speed)
Probe Pitch	0.3–2.54 mm
Life Cycle Reliability	1000+ hours of resistance under defined conditions
Quantity per Package	10, 50, 100+
Packaging Material	Anti-static plastic box, foam
Overall Dimensions	Customized as per model
Customization	Provided on request

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Choosing Johoty’s spring probe will give you high precision, long life cycles, stable performance. We focus on IC chip tests, provide cost-effective solutions for maximum efficiency & minimum costs.

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Spring Probe for IC Chipset, OD 0.26~3.50mm,, Applications

Semiconductor chip testing

This is a ommon application of spring probe. It can test whether IC chip is working properly. Spring probe contacts tiny electrode points on the chip to check circuit conductivity, signal accuracy, and performance compliance. It helps engineers identify problems in chip production and avoid subsequent errors. The extremely small contact area allows for precise testing without damaging IC chip.

Chip packaging testing

After chip packaging, spring probe checks if the packaging is successful. Test probe ensures connection quality between the chip and the package pins, and detects wire breakage and virtual soldering. Spring probe can also check whether the performance of the packaged chip has changed, ensuring that the chip performs normally in the next stage.

PCBA circuit board testing

Spring probe detects the connection between chips and other components on the circuit board. Spring probe tests the electrical performance of each welding point, detecting virtual soldering, short circuits, and open circuits. This type of testing greatly improves the reliability of the circuit board and is an important step in quality control.

Memory module testing

Johoty’s pring probe tests the performance and stability of memory chips or modules. Spring probe checks for normal data read and write speed, capacity, and whether there are any bad blocks. These tests ensure that the memory is excellent in the device and there will be no data loss or speed issues.

High frequency signal testing

Spring probe can test high-frequency signals, test 5G chips requires very precise connections. Spring probe helps engineers measure signal transfer quality, frequency response, and interference conditions to ensure chip stability at high speeds.

Wafer level testing

Before chip packaging, spring probe directly tests each chip on the wafer. Spring probe helps screen qualified chips to avoid wasting subsequent packaging costs. Wafer testing greatly improves production efficiency and reduces unnecessary resource waste.

Power device testing

Spring probe can test power chips such as MOSFETs, IGBTs, etc. Spring probe measures current, voltage, and power consumption to ensure stable operation of power devices under high loads. This is crucial for electric vehicles and energy equipment.

Consumer Electronics Testing

When producing mobile phones and tablets, spring probe checks whether the chip and circuit are normal. Spring probe quickly detects short or open circuits, ensures equipment is fully functional before leaving the factory. Make consumers’ devices more reliable and durable.

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Advantages of Spring Probe

Ultra high conductivity

Spring probe uses high-quality materials that conduct electricity very quickly with extremely low resistance. This makes IC chip signal transfer fast and accurate for high-speed chip tests. Measured data is very accurate, reducing energy waste and greatly improving work efficiency.

Excellent durability

The surface is coated with wear-resistant gold or silver plating, and the internal design is scientific, with lifespan of up to 1,000,000 cycles and strong corrosion resistance. Spring probe can work in harsh environments, reduces engineers’ time and cost to replace equipment.

Ultra precision structural design

Structural accuracy of IC spring probe is very high, using advanced 6-axis CNC, the contact is very reliable, chip interface is accurately docked with a small size, avoiding signal errors. The spring probe is suitable for IC chip tests with complex array structures and high accuracy requirements.

Excellent elasticity performance

The springs used in chip spring probe is piano steel, which has good elasticity and can recover well under high pressure. The contact force is stable and can adapt to different interface shapes. Spring probe won’t damage chip interface and can improve measurement consistency.

Extremely wide working range

This spring probe can work normally under extreme temperature and humidity changes, can adapt to various chip interface sizes and types. It is versatile and easy to use, meeting multiple needs.

Low contact resistance

Spring probe is gold or silver plated, with low contact resistance, smooth signal transfer, very low losses. They can improve test data stability, not easily oxidized after prolonged use, making them very durable.

Convenient installation and maintenance

This type of spring probe is easy to install, modular in design, easily replaced at any time. Even if it’s worn out, it can be directly plugged in and reused without complex operations, greatly saving engineers’ time and workload, and is very efficient.

Ultra high testing accuracy

The performance of spring probe is very stable, can detect slightest issues with IC chip, avoid missed or erroneous testing. It is suitable for use on IC chips testing at nanometer level, giving engineers more mind peace.

FAQ

What is an IC chip spring probe?

Spring probe is a precision tool used for IC chip testing, consisting of double springs, double plungers, and berrels. It connects IC chips and testing equipment, ensures stability and accuracy of IC signal transfer.

How to choose IC chip spring probe?

When selecting, you will consider plunger shape, length, spring force, rated current, etc, for compatibility between spring probe and testing equipment and chips.

What is spring probe purpose?

Spring probe is used for electrical performance testing of IC chips, ensuring IC chips have no problems during manufacturing processes. This can verify whether circuit connections and chip functions are normal.

What is spring probe lifespan?

Depending on usage and frequency, the lifespan of a spring probe ranges from 100,000 to 1,000,000 cycles. Regular replacement and proper use can extend spring probe lifespan.

Is spring probe easily damaged?

Spring probe is prone to damage due to excessive pressure, improper use, or surface wear, and should be handled with care and regularly inspected to reduce the risk of damage.

What are spring probe specs?

Common specifications include plunger and barrel diameter, plunger length, spring force, and rating current. Engineers select suitable spring probes based on testing requirements to meet accuracy and stability.

Does IC chip spring probe require special maintenance?

It is necessary to maintain cleanliness, avoid oil stains and dust accumulation, regularly check spring probe status, and replace them in time when they are worn or fail to ensure testing quality.

Is spring probe for high-frequency signal testing?

Sure, but you need to choose a spring probe specs that supports high frequencies. High frequency testing requires spring probe with low contact resistance and high stability to ensure signal transfer integrity.